电化学沉积工艺的优化  

Optimization of Electrochemical Fabrication Process

作　　者：丰伟 王颉 郑英彬[1] 杨晴[1] 唐彬[1] 支钞 高彩云 孙强 Feng Wei;Wang Jie;Zheng Yingbin;Yang Qing;Tang Bin;Zhi Chao;Gao Caiyun;Sun Qiang(Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621900,China)

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《微纳电子技术》2021年第1期80-86,共7页Micronanoelectronic Technology

基　　金：中国工程物理研究院超精密加工技术重点实验室资助项目(ZZ15001)。

摘　　要：电化学沉积由于可以加工基于非硅材料、高深宽比和免装配的复杂三维装置而极具潜力和优势,但是也存在加工周期长和成品率低的缺点。针对电化学沉积的缺点对加工工艺进行优化,包括工艺流程、去胶、清洗、平坦化和铜刻蚀,并通过加工一个5层微齿轮传动装置来比较优化前后的加工时间和成品率。测试结果表明:工艺流程优化将加工2层的用时从246 h缩短到201 h,缩短了约18.3%;去胶工艺的优化将去胶速度提高到1μm/min;清洗工艺的优化提高了层与层之间的结合力,提高了成品率;平坦化工艺的优化将平坦化工艺用时从40 h缩短到24 h,缩短了约40%;铜刻蚀工艺的优化将铜刻蚀工艺用时从60 h缩短到24 h,缩短了约60%。5层微齿轮传动装置的总加工时间从675 h缩短到357 h,缩短了约47.1%;成品率从约4.5%提高到约90.9%。产品测试结果显示器件的加工尺寸与设计尺寸较一致。For fabricating intricate 3 D devices based on non-silicon materials,high-aspect-ratio and non-assembly,the electrochemical fabrication reveals obvious potential and advantage,however it also has disadvantages of long fabrication period and low qualification rate.For the disadvantage of electrochemical fabrication,the machining processes were optimized,such as process flow,stripping process,cleaning process,planarization process and etching copper process.The fabrication time and qualification rate before and after optimization were compared by fabricating a5-layer microgear transmission device.Test results show that optimization of process flow reduces 2-layer fabricating time from246 h to 201 h,down about 18.3%.The optimization of stripping process increases stripping speed to 1μm/min.The optimization of cleaning process increases the adhesion between adjacent layers and qualification rate.The optimization of planarization process reduces process time from40 h to 24 h,down about 40%.The optimization of etching copper process reduces process time from60 h to 24 h,down about 60%.The total fabricating time of the 5-layer microgear transmission device reduces from675 h to 357 h,down about 47.1%.The qualification rate increases from about 4.5%to about 90.9%.The product test result shows that the machining sizes of the device are consistent with the design sizes.

关 键 词：电化学沉积 多层微齿轮传动 去胶 清洗 平坦化 刻蚀 

分 类 号：TN305[电子电信—物理电子学]