集成电路制造中的化学机械抛光CMP国产设备应用  

Application of Domestic Equipment CMP in Integrated Circuit Manufacturing

作　　者：王智 王哲 曹孟云 WANG Zhi;WANG Zhe;CAO Mengyun(Shanghai Huali Microelectronics Co.,Ltd.,Shanghai 201203,China)

机构地区：[1]上海华力微电子有限公司,上海201203

出　　处：《集成电路应用》2021年第1期1-3,共3页Application of IC

基　　金：上海市经济和信息化委员会软件和集成电路产业发展专项基金(1500204)。

摘　　要：化学机械抛光CMP工艺是集成电路制造的核心技术,90%以上的高端CMP机台设备和抛光液、抛光垫等关键耗材均被国外供应商垄断。阐述CMP国产设备与大尺寸晶圆片生产线的有效结合,达到产学研合作攻关的目的,有利于快速提升我国CMP工艺设备水平,形成自主可控的产业链。CMP process is the core technology of integrated circuit manufacturing.More than 90%of high-end CMP machines and equipment,polishing liquid,polishing pad and other key consumables are monopolized by foreign suppliers.This paper describes the effective combination of domestic CMP equipment and large-size wafer production line to achieve the purpose of industry university research cooperation,which is conducive to quickly improve the level of CMP process equipment in China and form an independent and controllable industrial chain.

关 键 词：集成电路制造 晶圆 化学机械研磨 

分 类 号：TP405[自动化与计算机技术]