热超声键合第二焊点研究进展  

Progress in the Second Bond of Thermosonic Bonding

作　　者：徐庆升 陈悦霖 XU Qingsheng;CHEN Yuelin(Hefei Tong Fu Microelectronics Co.,Ltd.,Hefei 230601,China)

机构地区：[1]合肥通富微电子有限公司,合肥230601

出　　处：《电子与封装》2021年第7期22-32,共11页Electronics & Packaging

摘　　要：热超声键合是目前最重要的引线键合技术,在电子封装领域中有着广泛的应用。面对封装密度不断提高、焊点节距不断下降和成本持续降低等挑战,需要全面了解热超声键合技术的研究进展。热超声键合包括两个焊点,其在外形、键合过程和冶金特性等方面均不相同。对于热超声键合中的第一焊点已有较为深入的研究。但是,关于热超声键合第二焊点仍缺乏系统的论述,不能很好地应对挑战。通过总结键合机理、键合质量和可靠性测试等方面的研究成果,介绍热超声键合第二焊点研究的发展现状,并对研究方向提供建议。Thermosonic bonding,which has been extensively applied in electronic packaging,is the most important wire bonding technology at present.Confronted with the challenges,including increased packaging density,decreasing bond pitch and keeping cost as low as possible,it is necessary to fully understand the research progress in thermosonic bonding technology.Thermosonic bonding includes two bonds,which are different in shape,bonding process and metallurgy.The first bond in thermosonic bonding has been deeply studied.However,there is a lack of systematic discussion on the second bond of thermosonic bonding,which could not deal with the challenges.The advances in the second bond of thermosonic bonding is presented by summarizing the investigation on bonding mechanism,bonding quality and reliability test,and the advices on further research are provided.

关 键 词：引线键合 热超声键合 第二焊点 键合机理 键合质量 键合可靠性 

分 类 号：TN305.94[电子电信—物理电子学]