焊点形态对表贴引脚元器件振动应力的影响  

Influence of solder joint morphology on vibration stress of surface mount components

作　　者：何敏[1] 邓梦 庄成波 HE Min;DENG Meng;ZHUANG Chengbo(th Research Institute of China Electronics Technology Group Corporation,Chengdu610031,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610031

出　　处：《电子元件与材料》2021年第8期800-807,813,共9页Electronic Components And Materials

基　　金：核高基国家科技重大专项(2017ZX01013201)。

摘　　要：为掌握焊点形态参数对引脚表贴元器件振动可靠性的影响,采用HyperMesh和ANSYS软件建立了带引线的塑料芯片载体(PLCC)和小外形(SO)封装元器件的印刷电路板组件(PCBA)有限元精确模型并进行随机振动仿真,研究了悬出、侧面长度、填充高度等焊点形态参数变化对J形引脚、L形引脚、焊点与焊盘上振动应力的影响规律。结果预示,悬出参数增加会导致PLCC封装焊盘和SO封装焊点的振动应力显著提升;合理的侧面长度能够明显降低PLCC封装引脚、焊点和SO封装焊盘的振动应力;填充高度增加会引起PLCC封装引脚、焊点振动应力明显变大。证明了焊点形态参数的优化能够明显增强引脚表贴元器件振动可靠性。In order to investigate the influence of the solder joint morphological parameters on the vibration reliability of the leaded surface mount components,an precise finite element model of printed circuit board(PCB)assembly with plastic leaded chip carrier(PLCC)and small outline(SO)packages was established,and then a series of random vibration simulation were performed using HyperMesh and ANSYS.The dependence of the vibration stress in J-leads,L-leads,solder joints and solder pads on different morphological parameters,such as overhang size,side length and filling height,was comprehensively studied.The results demonstrate that the increase of overhang size would significantly increase the vibration stress in the solder pads of PLCC packages and the solder joints of SO packages.A reasonable side length can significantly reduce the vibration stress in the leads and solder joints of PLCC packages as well as solder pads of SO packages.Increased filler height would cause obviously larger vibration stress in the leads and solder joints of PLCC packages.In conclusion,by optimizing the morphological parameters of solder joint,the vibration reliability of the leaded surface mount components can be significantly improved.

关 键 词：表贴元器件 焊点形态参数 引脚 焊点 焊盘 振动应力 

分 类 号：TG306[金属学及工艺—金属压力加工]