真空油炸食用菌脆片低含油率加工技术  

Processing Technology of Vacuum Fried Edible Fungi Chips with Low Oil Content

作　　者：曹晶晶[1] 罗晓莉[1] 何容[1] 张微思[1] 张沙沙[1] 孙达锋[1] CAO Jing-jing;LUO Xiao-li;HE Rong;ZHANG Wei-si;ZHANG Sha-sha;SUN Da-feng(Kunming Edible Fungi Institute of All China Federation of Supply and Marketing Cooperatives,Kunming 650221,China)

机构地区：[1]中华全国供销合作总社昆明食用菌研究所,云南昆明650221

出　　处：《中国食用菌》2022年第1期67-69,75,共4页Edible Fungi of China

基　　金：云南省重大科技专项计划项目课题(202002AE320003,202002AE320003-04);科技人才与平台计划(202005AE160001)。

摘　　要：食用菌脆片鲜香酥脆,受到众多消费者的喜爱。真空油炸技术是目前加工食用菌脆片的主要技术,但在传统真空油炸技术的基础上,降低脆片含油率仍然是提升产品品质的重要研究方向。通过综述真空油炸食用菌脆片加工过程中,漂烫、渗透脱水、涂膜、冷冻、预干燥等的物料预处理方式,油炸过程中工艺参数的筛选优化,以及油炸后真空脱油、联合干燥等处理工艺要点,联合工艺应用,以得到含油率显著低于传统真空方式的油炸食用菌脆片产品。对真空油炸食用菌脆片开发中其他常见的问题进行了简述分析,以期为真空油炸食用菌脆片产品的开发提供参考。Edible fungi chips are delicious, which are loved by many consumers. Vacuum frying technology is a main technology for processing edible fungi chips at present, but on the basis of traditional vacuum frying technology, reducing the oil content of chips is still an important research direction to improve product quality. In order to obtain the fried edible fungus chips with oil content significantly lower than that of traditional vacuum method,the material pretreatment methods such as blanching, osmotic dehydration, coating, freezing and pre drying in the processing of vacuum fried edible fungus chips, the screening and optimization of process parameters in the frying process, as well as the key points of vacuum deoiling and combined drying after frying, and the application of combined process were reviewed. Other common problems in the development of vacuum fried mushroom chips were briefly analyzed in order to provide reference for the development of vacuum fried mushroom chips.

关 键 词：真空油炸 食用菌脆片 预处理 含油率 

分 类 号：S646.9[农业科学—蔬菜学]