星载微波组件微组装技术研究  

Micro-assembly Technologies for Satellite-borne Microwave Module

作　　者：许立讲[1] 韩宗杰[1] 胡永芳[1] XU Lijiang;HAN Zongjie;HU Yongfang(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2022年第3期55-58,共4页Electro-Mechanical Engineering

摘　　要：星载微波组件是天基合成孔径雷达的核心部件,它由许多元器件经过高密度组装而成。针对天基雷达星载微波组件高精度、高一致性、高可靠微组装的技术要求,文中开展了星载微波组件微组装技术研究,重点介绍了低空洞率芯片焊接、低出气率芯片胶接、高可靠引线键合、抗辐照防护设计、低水汽含量气密封装等一系列关键技术,成功研制了高精度、高一致性、高可靠的星载微波组件,满足了某型天基合成孔径雷达的相关技术要求。研究成果为高精度、高一致性、高可靠微波组件的研制奠定了技术基础。Satellite-borne microwave modules are the core components of space-based synthetic aperture radar(SAR), which are assembled compactly by many components. According to the micro-assembly technical requirements of high precision, high consistency and high reliability for the satellite-borne microwave modules of space-based SAR, this paper carries out the research of micro-assembly technology of the modules, focusing on the key technologies such as low voidage chip soldering, low outgassing rate chip bonding, high reliability wire bonding, radiation protection design and low moisture content hermetic packaging. The satellite-borne microwave module with high precision, high consistency and high reliability is successfully developed, which meets the relevant technical requirements of a space-based SAR. This research establishes the technical foundation for the development of satellite-borne microwave module with high precision, high consistency and high reliability.

关 键 词：星载微波组件 微组装 芯片组装 引线键合 气密封装 

分 类 号：TN61[电子电信—电路与系统]