回流焊工艺对SMT器件热翘曲的影响  

Effect of Reflow Soldering Process on Thermal Warpage of SMT Devices

作　　者：吕贤亮[1] 杨迪[1] 毕明浩 时慧 LYU Xianliang;YANG Di;BI Minghao;SHI Hui(China Electronics Standardization Institute,Beijing 100176,Chin)

机构地区：[1]中国电子技术标准化研究院,北京100176

出　　处：《电子与封装》2024年第5期37-41,共5页Electronics & Packaging

摘　　要：集成电路正在向小型化、高集成度的方向发展,回流焊工艺已成为其组装过程中的关键技术。在回流焊过程中集成电路容易发生热翘曲现象。采用阴影云纹法对PBGA1296、PBGA1024器件在不同回流焊温度、升降温速率的回流焊工艺下的热翘曲进行测量,在此基础上通过建模仿真对实验结果进行分析。结果表明,采用表面贴装技术(SMT)的BGA器件的热翘曲会随着回流焊温度的升高而增大,回流焊升降温速率较快同样会导致严重的热翘曲。实验结果与仿真结果高度一致,进而验证了仿真模型的准确性和有效性。采用实验结合有限元分析的方法为改善集成电路热翘曲提供了参考。Integrated circuits are developing in the direction of miniaturization and high integration,and the reflow soldering process has become a key technology in their assembly process.Integrated circuits are prone to thermal warpage in the reflow soldering process.The thermal warpage of PBGA1296 and PBGA1024 devices under reflow soldering processes with different reflow soldering temperatures and rise and fall temperature rates,is measured using the shadow cloud method,and the experimental results are analyzed by modelling simulation on this basis.The results show that the thermal warpage of BGA devices using surface mount technology(SMT)will increase with the reflow soldering temperature,and the fast reflow rise and fall temperature rate can also lead to severe thermal warpage.The experimental results are highly consistent with the simulation results,which in turn verifies the accuracy and validity of the simulation model.The method of experiments combined with finite element analysis provides a reference for improving the thermal warpage of integrated circuits.

关 键 词：封装技术 回流焊 SMT器件 热翘曲 

分 类 号：TN305.94[电子电信—物理电子学]