基于硅通孔互连的芯粒集成技术研究进展  

Research Progress of Chiplet Integration Technology Based on Through Silicon Via Interconnection

作　　者：张爱兵 李洋 姚昕 李轶楠 梁梦楠 ZHANG Aibing;LI Yang;YAO Xin;LI Yi’nan;LIANG Mengnan(Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2024年第6期95-108,共14页Electronics & Packaging

摘　　要：通过先进封装技术实现具有不同功能、工艺节点的异构芯粒的多功能、高密度、小型化集成是延续摩尔定律的有效方案之一。在各类的先进封装解决方案中,通过硅通孔(TSV)技术实现2.5D/3D封装集成,可以获得诸多性能优势,如极小的产品尺寸、极短的互连路径、极佳的产品性能等。对TSV技术的应用分类进行介绍,总结并分析了目前业内典型的基于TSV互连的先进集成技术,介绍其工艺流程和工艺难点,对该类先进封装技术的发展趋势进行展望。Realizing multi-functional,high-density and miniaturized integration of heterogeneous Chiplets with different functions and process nodes through advanced packaging technology is one of the effective solutions to continue Moore's Law.Among the various types of advanced packaging solutions,2.5D/3D packaging integration based on through silicon via(TSV)technology has a number of performance advantages,such as extremely small product size,extremely short interconnect path and excellent product performance.The application classification of TSV technology is introduced.The typical advanced integration technologies based on TSV interconnection in the industry are summarized and analyzed,and their process flow and process difficulties are introduced.The development trend of this type of advanced packaging technology is prospected.

关 键 词：硅通孔 先进封装 芯粒 异构集成 2.5D封装 3D封装 

分 类 号：TN305.94[电子电信—物理电子学]