金属陶瓷管壳与陶瓷盖板的平行缝焊工艺应用  

Application of Parallel Seam Sealing between Metal-ceramic Package and Ceramic Cover

作　　者：崔洪波[1] 方健 马奔驰 刘艳[1] 吴迪 CUI Hongbo;FANG Jian;MA Benchi;LIU Yan;WU Di(Nanjing Electronic Devices Institute,Nanjing 210016,China)

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《电子工艺技术》2024年第6期22-25,共4页Electronics Process Technology

基　　金：技术基础科研项目(JSBZ2022210A001)。

摘　　要：采用平行缝焊工艺代替钎焊工艺进行金属陶瓷管壳和陶瓷盖板的气密封装,可以避免微波功率放大器密封焊接过程中芯片贴装焊料发生二次重熔,提高电子器件可靠性。通过金属陶瓷管壳和陶瓷盖板的结构设计,实现了器件的平行缝焊密封工艺,密封样品的焊接质量优良。对采用该工艺进行密封的微波功率放大器进行可靠性试验和微波性能测试,结果表明其气密性优异、可靠性稳定、微波性能合格,可满足电子器件的高可靠性需求。In the hermetic sealing process of metal ceramic packaging and ceramic cover,parallel seam sealing is used instead of brazing sealing to avoid the remelting of the die mounting solder,which is beneficial to the reliability of electronic devices.Through the structural design of the metal ceramic package and ceramic cover plate,the parallel seam sealing process of the device has been achieved,and the welding quality of the sealed sample is excellent.The reliability test and microwave performance test are conducted on the microwave power amplifier sealed using this process,and the results showed that it has excellent airtightness,stable reliability,and qualified microwave performance,which can meet the high reliability requirements of electronic devices.

关 键 词：微组装 气密封装 平行缝焊 微波功率器件 

分 类 号：TN605[电子电信—电路与系统]