聚酰亚胺在MEMS中的特性研究及应用  

Characteristic and application of polyimide in MEMS

作　　者：邓俊泳[1] 冯勇建[2] 

机构地区：[1]厦门大学机电工程系,福建厦门361005 [2]厦门大学萨本栋微机电研究中心,福建厦门361005

出　　处：《微纳电子技术》2003年第4期30-33,共4页Micronanoelectronic Technology

摘　　要：聚酰亚胺具有耐高温、耐腐蚀、绝缘性能好、化学性质稳定等特点,在MEMS工艺中有很广泛的应用前景,适于做牺牲层、绝缘层和平坦层等。在简要介绍聚酰亚胺的基础上,着重介绍聚酰亚胺在MEMS工艺中的特性、工艺流程及应用。Polyimide can resist high temperature and etching,and has excellent properties of in-sulation and chemical stabilization.It would be applied widely in MEMS process,especially befit to be used as sacrificing layer,insulating layer,smooth layer,etc.Based on the simple intro-duction of polyimide,the characteristic,process flow and applications in MEMS are introduced emphatically.

关 键 词：聚酰亚胺 MEMS 牺牲层 绝缘层 平坦层 工艺流程 高分子材料 微机电系统 

分 类 号：TH－39[机械工程] O633.22[理学—高分子化学]