低温共烧氮化铝复合材料基板的银金属化研究  

Research of silver metalization on the surface of AlN composite based cofire at low temperature

作　　者：李勇[1] 汪荣昌[1] 戎瑞芬[1] 顾之光[1] 廖淼[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《功能材料》2003年第3期338-341,348,共5页Journal of Functional Materials

基　　金：国家自然科学基金重点资助项目(69836030)

摘　　要：　基于氮化铝陶瓷基片厚膜导体浆料理论,开发出应用于低温共烧氮化铝流延坯、硼硅酸盐玻璃粘结相的银浆,并系统研究了共烧过程,解决了常见的导线球化问题。成功地进行了3层氮化铝复合材料基板的低温共烧银金属布线。Research on cofiring process of AlN composites base metalization was conducted systematically applying selfdeveloped silver paste based on thick film sintering theory. Three layers cofired metalized sample was obtained sucessfully after lots of problems shooting such as ball shaped shrinkage.

关 键 词：多芯片组件 低温共烧 氮化铝 复合材料 银金属化 球化 银浆 布线 

分 类 号：TN305[电子电信—物理电子学]