混合电路用导电胶及其体电阻率的测试  

Characteristics of Conducting Adhesives for Hybrid Circuits and Measurement of Its Volume Resistivity

作　　者：邢宗锋[1] 刘学如[1] 肖玲[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2003年第4期298-300,305,共4页Microelectronics

摘　　要：　介绍了MCM混合电路用导电胶的组成及其工艺特点,对两种测试导电胶体电阻率的方法进行了探讨,并对其优缺点进行了比较。此外,还简要介绍了混合电路用导电胶的发展动向。The composition of conducting adhesives and its characteristics are describedTwo methods for measurement of the volume resistivity of conducting adhesives are discussed,and the advantages and disadvantages of each method are compared Finally,the developing trend of the conducting adhesives for hybrid circuits is viewed

关 键 词：混合电路 导电胶 体电阻率 测试 MCM 封装材料 

分 类 号：TN45[电子电信—微电子学与固体电子学]