三级微电子封装技术  

Three Levels Microelectronic Packaging Technology

作　　者：况延香[1] 朱颂春[1] 

机构地区：[1]中国电子科技集团公司第43研究所,安徽合肥230022

出　　处：《电子工艺技术》2004年第3期134-137,共4页Electronics Process Technology

摘　　要：微电子封装一般可分为三级封装,即用封装外壳(金属、陶瓷、塑料等)封装成单芯片组件(SCM)和多芯片组件(MCM)的一级封装,常称芯片级封装;将一级封装和其它元器件一同组装到基板(PWB或其它基板)上的二级封装,又称板级封装;以及再将二级封装组装到母板上的三级封装,这一级也称为系统级封装。(而一、二级封装的关系更加密切,已达到技术上的融合)。Microelectronic packaging is generally devided into three levels packaging.SCM and MCM are the first level packaging,are called chip level packaging;the first level packaging and other components are assembled on the same board,which is called the second level packaging,or board level packaging;the secomd pacagaing are assembled on the motherboard,which is called the third packaging,or system level packaging.

关 键 词：芯片级封装 板级封装 系统级封装 

分 类 号：TN4[电子电信—微电子学与固体电子学]