高密度、高性能IC封装的现状及发展趋势  

Current Status and Trend of IC Packaging with High-Density, High-Performance

作　　者：苏世民[1] 

机构地区：[1]电子部第13研究所,石家庄050051

出　　处：《半导体情报》1993年第6期51-57,共7页Semiconductor Information

摘　　要：本文描述了高密度、高性能IC封装的现状、目前常用的几种类型以及当前面临的问题。并指出,高密度封装将逐步被一种更新的封装——多芯片组件(MCM)所代替。MCM的出现将对军事、航空、高端计算机和远距离通信产生深远的影响。This paper describes the current status of high-density, high-performance mtegrated circuit packaging. It gives the common types of packaging and some problems it confronts. It also shows that high-density packaging will be progressively replaced by newly emerging packaging multichip module (MCM) and it will surely have deep influences upon many important fields such as military, aerospace, highend computers, long distance telecommunication and so on.

关 键 词：封装 多芯片组件 混合集成电路 

分 类 号：TN45[电子电信—微电子学与固体电子学]