CONDITIONER

作品数：29被引量：32H指数：3
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相关领域：电气工程更多>>
相关作者：张凯杨志刚王东陈辉吴介一更多>>
相关机构：东南大学莱雅公司同济大学南京大学更多>>
相关期刊：《Journal of Integrative Agriculture》《Chinese Journal of Mechanical Engineering》《Agricultural Biotechnology》《金刚石与磨料磨具工程》更多>>
相关基金：国家自然科学基金中国博士后科学基金国家重点基础研究发展计划广东省自然科学基金更多>>
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Diamond breakage on CMP pad conditioner
《金刚石与磨料磨具工程》2008年第S1期115-118,共4页Liu Ping-Hsiao Sung James C. Hsu Kai-Hung Sung Michael 
Diamond grits may be thermally weakened during the high temperature cycle of brazing.This weakening may exhibit as diamond breakage.During the dressing action,taller diamond grits are more likely to break due to the h...
关键词：DIAMOND BRAZING DIAMOND BREAKAGE CMP PAD CONDITIONER 
The organic diamond disk(ODD)for dressing polishing pads of chemical mechanical planarization被引量：1
《金刚石与磨料磨具工程》2008年第S1期126-129,共4页Chou Cheng-Shiang Sung James C. Pai Yang-Liang Sung Michael 
Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity ...
关键词：CMP DIAMOND DRESSER pad CONDITIONER epoxy 
The fabrication of ideal diamond disk(IDD)by casting diamond film on silicon wafer被引量：1
《金刚石与磨料磨具工程》2008年第S1期130-133,142,共5页Chen Ying-Tung Sung James C. Kan Ming-Chi Chang Hsiao-Kuo Sung Michael 
With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not o...
关键词：CMP pad CONDITIONER DIAMOND film CVD Moore’s Law 32 nm node 
The brazing of diamond被引量：2
《金刚石与磨料磨具工程》2008年第S1期134-142,共9页Sung Michael Sung James C. 
support of this research by Kinik Company.
Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Mo...
关键词：DIAMOND BRAZING DIAMOND DRESSER pad CONDITIONER DIAMOND ADHERENCE DIAMOND distribution chemical mechanical PLANARIZATION 
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