先进封装技术的发展与机遇  

Development and Opportunity of Advanced Packaging Technology

作　　者：曹立强[1] 侯峰泽[1] 王启东[1] 刘丰满[1] 李君[1] 丁飞 孙思维 周云燕[1] CAO Liqiang;HOU Fengze;WANG Qidong;LIU Fengman;LI Jun;DING Fei;SUN Siwei;ZHOU Yunyan(Institute of Microelectronics of the Chinese Academy of Sciences,Beijing 100029,China)

机构地区：[1]中国科学院微电子研究所,北京100029

出　　处：《前瞻科技》2022年第3期101-114,共14页Science and Technology Foresight

基　　金：国家自然科学基金(62174177,U21A20504)

摘　　要：近年来,先进封装技术的内驱力已从高端智能手机领域演变为高性能计算和人工智能等领域,涉及高性能处理器、存储器、人工智能训练和推理等。当前集成电路的发展受“四堵墙”(“存储墙”“面积墙”“功耗墙”和“功能墙”)制约,以芯粒(Chiplet)异质集成为核心的先进封装技术,将成为集成电路发展的关键路径和突破口。文章概述近年来国际上具有“里程碑”意义的先进封装技术,阐述中国内地先进封装领域发展的现状与优势,分析中国内地先进封装关键技术与世界先进水平的差距,最后对未来中国内地先进封装发展提出建议。Advanced packaging technology,whose drive has evolved from high-end smartphones to high-performance computing and artificial intelligence(AI),mainly involves high-performance processors,memories,and AI training and inference.As the development of integrated circuits is constrained by the memory,area,power consumption,and function,the advanced packaging technology with chiplet heterogeneous integration at its core will be the key path and breakthrough for the development of integrated circuits.This paper reviews some advanced packaging technologies of milestone significance worldwide and presents the development status and advantages of advanced packaging in China.After that,it analyzes the gap between China and the world’s advanced level and put forward some suggestions for the development of China’s advanced packaging technology.

关 键 词：高性能计算 人工智能 芯粒 异质集成 先进封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]