LIGA技术微电铸镍的电化学研究  

An Electrochemical Study of Micro-electroforming Ni for LIGA Technique

作　　者：李永海[1] 丁桂甫[1] 张永华[1] 曹莹[1] 赵小林[1] 

机构地区：[1]上海交通大学微纳米技术研究院,上海200030

出　　处：《电镀与环保》2005年第2期8-10,共3页Electroplating & Pollution Control

基　　金：国家"8 63"计划 (2 0 0 3AA40 414 0 );国防预研课题 (0 2 413 0 80 5 0 116)

摘　　要：微电铸工艺兼具掩膜电镀和厚膜结构电铸的双重特征。采用线性电位扫描和电化学交流阻抗等电化学测量技术 ,对高深宽比掩膜条件下微电铸镍的电极反应动力学过程进行了初步研究。结果显示 ,高深宽比掩膜使扩散传质过程更容易成为电极反应的控制因素 ,并由此导致深层微电铸结构疏松多孔等缺陷。提高电镀过程传质能力的改良工艺能够显著改善微电铸镍结构的整体品质。Micro-electroforming is characterized by both resist-patterned electr oplating and resist-structural electrodepositing. The kinetics of the electrode reaction is preliminarily studied by linear potential sweep technique and electrochemical impedance while electrodepositing Ni for high aspect ratio structures. The results show that ma ss transfer and diffusion are easier to be the control factors of electrode reaction in electro forming due the high aspect ratio mask, which will result in electroforming defects. The advanc ed electroforming techniques, which reformed mass transfer ability, can improve th e performances of electroforming microstructures.

关 键 词：电铸镍 LIGA技术 电化学研究 电化学交流阻抗 线性电位扫描 电极反应 高深宽比 动力学过程 电铸工艺 测量技术 控制因素 传质过程 改良工艺 电镀过程 膜结构 掩膜 微电铸 多孔 

分 类 号：TQ153.43[化学工程—电化学工业] TN305.7[电子电信—物理电子学]