多功能真空键合设备的研制  

Development of a Multifunctional Equipment for Vacuum Wafer Bonding

作　　者：汪学方[1] 杨俊波[1] 张鸿海[1] 

机构地区：[1]华中科技大学,湖北武汉430074

出　　处：《机械与电子》2005年第6期32-34,共3页Machinery & Electronics

基　　金：国家"八六三"高技术研究发展计划资助项目(2002AA404430;2004AA404221)

摘　　要：基于圆片键合技术,设计了一种在真空条件下进行圆片键合的工艺设备.在该设备的基础上,进行了阳极键合与金硅键合2种典型的键合试验,键合出来的样品结合强度高而且没有缺陷,验证了该设备的实用性.An equipment for vacuum wafer bonding was developed based o n the wafer bonding technology.At the same time,two experiments of anodic bonding and goldsilicon bonding were carried out on the equipment,and the samples of the experiments have no defect and have good capability of combination,which proved the practicability of the equipment.

关 键 词：微机电系统 圆片键合 阳极键合 金硅 键合 

分 类 号：TN405[电子电信—微电子学与固体电子学]