BGA封装中含Bi,Ni的无铅焊球剪切强度研究  

Shear Strength of Lead-Free Solder Ball Doped with Bi and Ni in BGA Packaging

作　　者：华彤[1] 王珺[1] 俞宏坤[1] 肖斐[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《复旦学报（自然科学版）》2006年第4期489-494,共6页Journal of Fudan University：Natural Science

基　　金：APEC科技产业合作基金资助项目

摘　　要：对Sn/3.5Ag/0.7Cu,Sn/3Ag/3Bi/0.5Cu和Sn/3Ag/3Bi/0.5Cu/0.1Ni三种BGA无铅焊球(0.76 mm)经不同热循环后,在FR-4基板上的剪切强度进行了测量.采用SEM和EDX对样品截面进行观察和元素分析.数据表明,Bi的掺入提高了焊料的润湿性及焊接强度,并减缓了IMC的生长速度;焊料中加入微量Ni可有效减小焊点下金属上Ni镀层的耗穿速度,抑制了焊球经热循环后焊接强度的下降.Shear strength of three kinds of BGA solder joints on FR-4 boerd with Cu pads is studied. The lead-free solders of Sn/3.5Ag/0.7Cu, Sn/3Ag/3Bi/0.5Cu and Sn/3Ag/3Bi/0.5CuA3.1Ni are used to make the BGA balls which are mounted on FR-4 board by solder reflow. After the thermal cycles, ball shear test was performed. In order to observe the microstructure and composition of IMC at interface, SEM and EDX are used to analyze of the samples. The experiment data show that Bi enhances the strength of solder joints by reducing the growth rate of IMC at the interface between solder and Cu pads; while Ni is effective to suppress the decreasing of the solder joints strength by depressing the consumption of the plated Ni on UBM.

关 键 词：半导体工艺 无铅焊料 球栅阵列封装 封装可靠性 金属间化合物 

分 类 号：TN306[电子电信—物理电子学]