Cu/Sn等温凝固技术在MEMS气密封装中的应用  

Cu/Sn Isothermal Solidification Technology for Hermetic Packaging of MEMS

作　　者：李莉[1] 焦继伟[1] 王立春[1] 吴艳红[1] 罗乐[1] 王跃林[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所

出　　处：《固体电子学研究与进展》2007年第3期371-374,共4页Research & Progress of SSE

基　　金：863项目(2005AA404020)

摘　　要：研究了Cu／Sn等温凝固键合技术在MEMS气密性封装中的应用。设计了等温凝固键合多层材料的结构和密封环图形，优化了键合工艺，对影响气密性的因素（如密封环尺寸等）进行了分析。在350。C实现了良好的键合效果，其最大剪切强度达到27．7MPa，漏率～2×10^-4Pa·cm^3／s He，完全可以满足美国军方标准（MIL—STD-883E）的要求，验证了Cu／Sn等温凝固键合技术在MEMS气密封装中的适用性。The paper introduces a novel hermetic packaging technology for MEMS based on Cu/Sn isothermal solidification（IS）. We designed the structure of the intermediate multi-layer and the pattern of sealing rings, optimized the bonding process, and analyzed key factors affecting the hermeticity, such as the dimension of the sealing rings. Successful Cu/Sn IS bonding was realized at a low bonding temperature of 350 ℃ under the optimal conditions. High shear strength of 27.7 MPa and excellent leak rate of around 2×10^-4 Pa · cm^3/s He have been achieved, which meet the requirements of MIL-STD-883E.

关 键 词：等温凝固 气密封装 晶圆级封装 

分 类 号：TN432[电子电信—微电子学与固体电子学]