微电子封装设备精密定位系统的分析  

Analyses of Precision Positioning System in Microelectronics Packaging Equipments

作　　者：印波[1] 李克天[1] 刘吉安[1] 蔡召虎[1] 陈铁强[1] 

机构地区：[1]广东工业大学,广东广州510006

出　　处：《装备制造技术》2008年第11期41-44,共4页Equipment Manufacturing Technology

摘　　要：根据微电子封装设备定位平台高速高精度的特点,讨论了精密定位系统中工作台的机构形式、驱动方式、运动控制器、实时检测等关键技术的现状,为研发新型微电子封装高精密定位系统提供参考。With the specialty of high speed and high precision in the positioning table of microelectronics packaging equipments, this paper presents a detailed process on the present condition of work table structure, driving form, motion controller, real time examine device in precision positioning system. A useful reference for the research and development of new high precision positioning system for microelectronies packaging equipments were provided.

关 键 词：精密定位 XY工作台 驱动方式 运动控制器 实时检测 

分 类 号：TB486.1[一般工业技术—包装工程]