选择性抛光液的研究  

Research about the Selective Slurry

作　　者：刘涛[1] 于高洋[1] 周国安[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊101601

出　　处：《电子工业专用设备》2009年第6期36-39,共4页Equipment for Electronic Products Manufacturing

摘　　要：抛光液是化学机械平坦化的关键耗材,而针对STI和铜线的抛光,通常使用选择性抛光液。采用二氧化铈作为研磨颗粒的第二代抛光液,具有自动停止的特点,配合粗抛和精抛,能够十分有效解决目前STI存在的工艺缺点。而针对铜线的抛光,介绍了有机物作为研磨颗粒的抛光液,具备十分卓越的选择比,高产出和低缺陷,将是今后重点发展的产品类型之一。slurry is the important consume material of CMP, to polish the STI and copper wire, usually using the selective slurry. We can solve the process problem of STI by using the second generation CeO2 as the slurry, which has auto stopping characteristic, combining with two step polish： primary polish and final polish, to polish the copper wire, we selective the organic particle slurry, which has excellent selective rate, and high throughput with low defect, it＇s likely as the important developing product in the future.

关 键 词：化学机械抛光 浅沟道隔离 抛光液 二氧化铈 有机物 

分 类 号：TN305.2[电子电信—物理电子学]