铜丝键合工艺研究  

The Technics Research of Copper Wire Bonding

作　　者：常红军[1] 王晓春[1] 费智霞[1] 慕蔚[1] 李习周[1] 冯学贵[1] 鲁明朕[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子与封装》2009年第8期1-4,15,共5页Electronics & Packaging

摘　　要：键合铜丝作为微电子工业的新型研发材料,已经成功替代键合金丝应用于IC后道封装中。随着IC封装键合工艺技术及设备的改进,铜丝应用从低端产品如DIP、SOP向中高端QFP、QFN、多层线、小间距焊盘产品领域扩展。因封装制程对键合铜丝的性能要求逐步提高,促进了铜丝生产商对铜丝工艺性能向趋近于金丝工艺性能发展,成为替代金丝封装的新型材料。文章首先讲述了铜丝键合的优点,指出铜丝在键合工艺中制约制程的瓶颈因素有两个方面:一是铜丝储存条件对环境要求高,使用过程保护措施不当易氧化;二是铜丝材料特性选择、制具选择、设备键合参数设置不当在生产制造中易造成芯片焊盘铝挤出、破裂、弹坑等现象发生,最终导致产品电性能及可靠性问题而失效。文章通过对铜丝键合机理分析,提出解决、预防及管控措施,制定了具体的生产管控工艺方案,对实现铜丝键合工艺有很好的指导意义。Bonding Copper-wife has been applied in the IC package as the basic materials of the microelectronics industry, and lots of application can use it as a substitute for bonding gold-wire. As the IC package bonding technology development ＆ bonding equipment improvement, Bonding Copper-wire do not only applied in lowend products, such as DIP ＆ SOP, but also used more and more in high-end products-such as QFP ＆ QFN and fine-pitch bond-pad products. Because the performance requirements of copper-wire bonding become much higher than before, all copper-wire venders try to improve the copper-wire characteristic and let it close to goldwire. And, those efforts make ＂copper-wire＂ become a new material to replace the gold-wire. In the beginning of this paper, it describes the advantages of copper-wire bonding, then high-lights the two major bottle-necks which limited the copper-wire bonding process： One is the high request for store environment of copper-wire. That means copper-wire should be well protected to prevent the oxidation issue during the processes; the other is that the products electrical function or reliability would be failed because the bond-pad A1 bleed-out, bondpad broken, bond-pad crating problems if we use the unsuitable characteristic copper-wire, unsuitable jigs or wrong bonding parameters. This paper shown the related bonding intermetallic analysis, and provide the solution, prevention and control method for copper-wire bonding process. It provides a very good guide-line to realize the copper-wire process with the actual production control rule.

关 键 词：铜丝 键合 弹坑 工艺方案 

分 类 号：TN305.94[电子电信—物理电子学]