硅MEMS器件键合强度在线检测方法  

On-Line Examination Method of Bonding Strength Measurement in Silicon MEMS Devices

作　　者：李仁锋[1] 马凯[2] 郑英彬[1] 袁明权[1] 施志贵[1] 吴嘉丽[1] 

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900 [2]西安理工大学理学院工程力学系,西安710048

出　　处：《微纳电子技术》2009年第12期758-763,共6页Micronanoelectronic Technology

基　　金：国家部委基础科研资助项目

摘　　要：键合强度是MEMS器件研制中一个重要的工艺质量参数,键合强度检测对器件的可靠性具有十分重要的作用。为了获得MEMS器件制造工艺中的键合强度,提出了一种键合强度在线检测方法,并基于MEMS叉指式器件工艺介绍了一种新型键合强度检测结构;借助于材料力学的相关知识,推导出了键合强度计算公式,经过工艺实验,获得了键合强度检测数据;对获得的不同键合面积的键合强度加以对比,指出这些数据的较小差异,是由刻度盘最小刻度误差和尺度效应造成的。结合叉指式器件的工作环境,认为这种方法获得的键合强度更接近实际的工作情况。The bonding strength is one of important process quality parameters in MEMS devices, and the important effect is introduced on bonding strength measurement. In order to obtain MEMS devices bonding strength in the manufacturing process, an on-line measurement metheod of bonding strength was put forward. Based on MEMS comb device process, a new measurement structure was applied. The bonding strength computation formula was got by some knowledge on mechanics of materials. The bonding strength measurement data were obtained after process, the bonding strengths at different bonding interfaces were compared, and the less difference of bonding strength data was caused by minimum scale errors and scale effect. In the end, it is pointed out that the bonding strength is more close to fact work instance, combining the comb devices operational environment.

关 键 词：微电子机械系统 阳极键合 键合强度 微结构 在线检测 

分 类 号：TH703[机械工程—仪器科学与技术] TN407[机械工程—精密仪器及机械]