倒装焊接在压力敏感芯片封装工艺中的研究  

Research of Flip-chip Bonding in the Pressure Sensitive Chip’s Encapsulation Processing

作　　者：金忠[1] 谢锋[1] 何迎辉[1] 谢贵久[1] 陈云峰[1] 张川 潘喜成 杨毓彬 

机构地区：[1]中国电子科技集团公司第48研究所,长沙410111 [2]空军驻湖南军代室,长沙410100

出　　处：《电子与封装》2012年第9期10-13,共4页Electronics & Packaging

摘　　要：胶粘引丝无法实现硅压力敏感芯片的小型化封装,无引线封装可以解决该问题。倒装焊接具有高密度、无引线和可靠的优点,通过对传统倒装焊接工艺进行适当的更改,倒装焊接可应用于压力敏感芯片的小型化封装。采用静电封接工艺在普通硅压力敏感芯片上制作保护支撑硅基片,在硅压力敏感芯片的焊盘上制作金凸点,调整倒装焊接的工艺顺序和工艺参数,实现了绝压型硅压力敏感芯片的无引线封装,为压力传感器小型化开辟了一条新路。试验结果表明该封装方式可靠性高,寿命长,具有耐恶劣环境的特点。Silicon pressure sensitive chip can not be packaged into small size by Sticking-wring, leadless package can solve the problem. Flip-chip bonding has the advantages of high density, leadless and reliability, making the appropriate changes on the traditional flip-chip bonding process, the flip-chip bonding can be applied to small size packaging of silicon pressure sensitive chip. Protecting and supporting silicon substrate is seal in the ordinary silicon pressure sensitive chip by static sealing process, the gold salient points are fabricated on the pads of the silicon pressure sensitive chip, adjusted the process sequence and parameters of flip-chip bonding, the leadless package of absolute pressure silicon sensitive chip is realized, that opened up a new path for miniaturization of pressure sensors. The experimental results show that the packaging way high reliability, long life and good resistance to bad environment.

关 键 词：倒装焊接 压力传感器 封装 

分 类 号：TN305.94[电子电信—物理电子学]