Sn-3Ag-0.5Cu/Ni微焊点多次回流焊后IMC厚度及组织分析  

Analysis of IMC thickness and microstructure of Sn-3Ag-0.5Cu/Ni micro-joint after multi-reflow

作　　者：刘超[1] 孟工戈[1] 孙凤莲[1] 谷柏松[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《电子元件与材料》2013年第3期67-69,共3页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.51075107)

摘　　要：采用Sn-Ag-Cu焊球(直径200,300,400和500μm),镀Ni盘,研究1,3,5次回流焊条件下焊点的IMC厚度及显微组织与焊球尺寸间的关系。结果表明:对于同一尺寸的焊球,随着回流焊次数的增加,IMC的厚度增大,形状由平直状逐渐过渡为体钎料一侧凹凸不平;在同一回流焊次数下,随着焊球尺寸的增大,IMC厚度减小,形貌相对没有明显差别。IMC的组成成分随着Ni向体钎料方向的不断扩散而从Sn、Ag、Cu合金变成Sn、Ag、Cu、Ni合金,其主要组成部分为(Cu,Ni)6Sn5。Using Sn-Ag-Cu solder ball （diameter： 200, 300, 400, 500 μm）, plating Ni plate, the relationship between the IMC thickness, the microstructure oftbe solder joint and the size of the ball was researched under 1, 3, 5 multi-reflow. The results show that IMC thickness increases with the increase of the number of multi-reflow for the same size of the solder ball, its shape transforms gradually from flat to uneven on the body solder side of the interface compound; in the same number of multi-reflow, IMC thickness decreases with the increase of the solder ball size, and the relative morphology has no significant differences. Its composition transforms from Sn, Ag, Cu alloy into Sn, Ag, Cu, Ni alloy with Ni spread to body solder direction constantly, and （Cu, Ni）6Sn5 is the main part.

关 键 词：无铅钎料 尺寸效应 金属间化合物 Sn—Ag—Cu 回流焊 焊点 

分 类 号：TN601[电子电信—电路与系统]