LTCC在SiP中的应用与发展  

Application and Development of LTCC for SiP

作　　者：李建辉[1] 项玮[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230022

出　　处：《电子与封装》2014年第5期1-5,共5页Electronics & Packaging

摘　　要：SiP是实现先进电子设备小型化、多功能化和高可靠性的有效途径。SiP的组装和封装载体是基板。LTCC通过采用更小的通孔直径、更细的线宽/线间距和更多的布线层数能实现SiP复杂系统大容量的布线。通过采用空腔结构可以优化系统元器件的组装,提高散热能力。利用埋置无源元件,可以减少SiP表贴元件的数量。利用3D-MCM和一体化封装可以进一步减少系统的面积和体积,缩短互连线。未来SiP的发展要求LTCC具有更好的散热能力、更高的基板制作精度和更多无源元件的集成。SiP is an effective route to realize miniaturization, multifunction and high reliability of advanced electronic facilities. Assembly and packaging for SiP bases on substrate. By using lesser vias, more ifne line/line gap and more layer, LTCC can easily carry off the large capacity wiring for complex system. Assembly site of some SiP components can be optimized and heat disSiPation ability is higher by using LTCC cavities for SiP. LTCC can cut down the components mounted on substrate surface by embedding passive components, raises packing density and reliability for SiP. By means of LTCC 3D-MCM and integrated packaging, the system projected area and volume can be reduced further, the interconnection line can be shortened. It need good heat radiation, higher production precision and more integrated passive components for LTCC to meet SiP development.

关 键 词：LTCC SIP 埋置无源元件 3D-MCM 一体化封装 

分 类 号：TN305.94[电子电信—物理电子学]