一种计算对流空气条件下MCM器件结温的方法  

A Method to Calculate Junction-Temperature of MCM's Chips under the Condition of Air Conv

作　　者：翁建城 何小琦[2] 周斌[2] 刘岗岗 赵磊[1,2] 恩云飞[2] 

机构地区：[1]广东工业大学材料与能源学院,广东广州510006 [2]工业和信息化部电子第五研究所电子元器件可靠性物理及其应用国家重点实验室,广东广州510610

出　　处：《广东工业大学学报》2014年第4期104-108,131,共6页Journal of Guangdong University of Technology

基　　金：国家重点实验室开放基金资助项目(XF1128330)

摘　　要：研究多芯片组件(Multi-chip Module,MCM)各元器件之间热传导的相互影响,建立了在对流空气条件下,一种基于结环热阻矩阵的MCM各元器件结温数学计算方法,并利用有限元模拟方法根据不同组合条件对结环热阻矩阵进行验证,结果表明采用结环热阻矩阵预测元器件结温的误差小于6%,说明该方法在某种程度上可运用于对流空气条件下MCM组件的热学分析技术中.It investigated the influence of heat exchange between each chip on MCM,and presented the mathematical calculation method for the junction-temperature of MCM chips under the condition of air convection,based on junction-ambient thermal resistance matrix. Comparison between the results of ANSYS finite element simulation and calculated results via this method under different combination conditions shows that the error margin of junction-temperature forecast by junction-ambient thermal resistance matrix is less than 6%,which indicates that the junction-ambient thermal resistance matrix can be applied to heat analysis for MCM to some extent.

关 键 词：多芯片组件 结环热阻矩阵 结温 有限元模拟 热分析 

分 类 号：TN602[电子电信—电路与系统]