先进射频封装技术发展面临的挑战  

The Challenges Confronting the Development of Advanced RF Packaging Technology

作　　者：夏雨楠 陈宇宁[1] 许丽清[1] 戴洲[1] 李华新[1] 程凯[1] 

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《电子与封装》2016年第5期1-6,共6页Electronics & Packaging

摘　　要：随着射频技术的广泛应用和发展,射频封装已经呈现出更高密度功能集成、更高功率、更高频率和更低成本的发展要求。在这些要求下,3D封装、大功率射频器件集成、多种信号混合集成、硅中道工艺顺应而出。相对于传统射频封装,基于硅中道工艺的先进射频封装面临结构、热管理、信号完整性和工艺等多方面的挑战。With rapid development and wide application of RF technology, requirements of higher functional integration,higher RF power and frequency, lower cost are now pushing the RF packaging technology to involve 3D packaging, high power RF devices integration, multi-signal hybrid integration and middle-end process platform. Thus emerging out are challenges such as package structure, thermal management, signal integrity and process.

关 键 词：射频 中介层 3D封装 氮化镓 

分 类 号：TN305.94[电子电信—物理电子学]