浅谈引线框架上倒装芯片的封装  

Discussion on the Package of Flip Chip on Lead Frame Products

作　　者：王国励[1] 何乃辉 王立国[1] WANG Guoli;HE Neihui;WANG Liguo(Tianshui Huatian Technology Co .,Ltd,Tianshui 741000,China)

机构地区：[1]天水华天科技股份有限公司

出　　处：《电子工业专用设备》2019年第4期5-8,24,共5页Equipment for Electronic Products Manufacturing

摘　　要：阐述了倒装芯片(FC)封装产品的凸点制作过程与封装流程,并重点介绍倒装产品在传统封装过程中遇到的难点,从工艺的角度提出了相应的改善措施,确保倒装产品在封装过程的稳定性,从而满足产品的可靠性需求。This paper describes the production process of bump flip chip assembly products and its packaging flow, and focuses on encountering difficulties in the flip chip products in the traditional assembly process, the corresponding improvement measures are put forward with respect of the process, to ensure the stability of flip chip products in packaging process, so as to satisfy the reliability demand of product.

关 键 词：倒装焊 凸点 封装 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]