LTCC封装技术研究现状与发展趋势  

Research Status and Development Trend of LTCC Package Technology

作　　者：李建辉[1] 丁小聪 LI Jianhui;DING Xiaocong(Anhui Province Key Laboratory of Microsystem,the 43rd Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所微系统安徽省重点实验室,合肥230088

出　　处：《电子与封装》2022年第3期41-54,共14页Electronics & Packaging

摘　　要：低温共烧陶瓷(Low Temperature Co-Fired Ceramics,LTCC)封装能将不同种类的芯片等元器件组装集成于同一封装体内以实现系统的某些功能,是实现系统小型化、集成化、多功能化和高可靠性的重要手段。总结了LTCC基板所采用的封装方式,阐述了LTCC基板的金属外壳封装、针栅阵列(Pin Grid Array,PGA)封装、焊球阵列(Ball Grid Array,BGA)封装、穿墙无引脚封装、四面引脚扁平(Quad Flat Package,QFP)封装、无引脚片式载体(Leadless Chip Carrier,LCC)封装和三维多芯片模块(Three-Dimensional Multichip Module,3D-MCM)封装技术的特点及研究现状。分析了LTCC基板不同类型封装中影响封装气密性和可靠性的一些关键技术因素,并对LTCC封装技术的发展趋势进行了展望。Low temperature co-fired ceramics(LTCC)package can assemble and integrate different kinds of chips and other components into the same package to realize some functions of the system,which is important means to realize the miniaturization,integration,multi-function and high reliability of the system.The packaging methods of LTCC substrate,and expounds the characteristics and research status of LTCC substrate metal shell packaging,pin grid array(PGA)packaging,ball grid array(BGA)packaging,leadless through-wall package,quad flat package(QFP)packaging,leadless chip carrier(LCC)packaging and three-dimensional multichip module(3D-MCM)packaging technology are summarized.Some key technical factors affecting the airtightness and reliability of LTCC substrate packaging are analyzed,and the development trend of LTCC packaging technology is prospected.

关 键 词：LTCC 陶瓷封装 一体化封装 三维多芯片模块 系统级封装 

分 类 号：TN305.94[电子电信—物理电子学]