倒装焊结构的大规模集成电路焊点失效机理研究  

Research on Failure Mechanism of Solder Joints in Large-Scale Integrated Circuits with Flip-Chip Structures

作　　者：王欢 林瑞仕[2] 朱旭锋[2] 胡圣[1] 李凌 WANG Huan;LIN Ruishi;ZHU Xufeng;HU Sheng;LI Ling(Xi’an Microelectronic Technology Institute,Xi’an 710068,China;Beijing Aerospace Automatic Control Institute,Beijing 100076,China)

机构地区：[1]西安微电子技术研究所,西安710068 [2]北京航天自动控制研究所,北京100076

出　　处：《电子与封装》2023年第10期8-13,共6页Electronics & Packaging

摘　　要：在倒装焊结构的球栅阵列(BGA)封装大规模集成电路(LSIC)的服役过程中,由于BGA焊球、基板材料和PCB材料的热膨胀系数不同,焊点失效成为倒装焊结构LSIC的主要失效模式。焊点失效与焊料性质、焊接时间和温度、制造中的缺陷等密切相关。结合焊点失效的常见形貌及实例,研究倒装焊结构的LSIC的焊点失效模式及失效机理。针对可能引发失效的因素,提出从工艺到应用的一系列预防措施,对提升该类型电路的可靠性具有指导意义。During the service process of large-scale integrated circuits(LSICs)in ball grid array(BGA)packages with flip-chip structures,solder joint failure is the main failure mode of LSICs with flip-chip structures due to the different thermal expansion coefficients of the BGA solder balls,substrate materials and PCB materials.Solder joint failure is closely related to the solder properties,soldering time and temperature,and manufacturing defects.Combined with the common morphology and examples of the solder joint failure,the failure mode and failure mechanism of solder joints of LSICs with flip-chip structures are investigated.A series of preventive measures from process to application are proposed for the factors those may cause failure,which have strong guiding significance for improving the reliability of this type of circuits.

关 键 词：倒装焊 BGA封装 焊点失效 

分 类 号：TN305.94[电子电信—物理电子学]