3D封装凸点电镀技术发展现状与扩散阻挡层的研究进展  

Research progress on microbump plating technology in 3D packaging and diffusion barrier layers

作　　者：周湘卓 陈沛欣 凌惠琴[1] 李明[1] Zhou Xiangzhuo;Chen Peixin;Ling Huiqin;Li Ming(School of Materials Science and Engineering,Shanghai Jiao Tong University,Shanghai 200240,China)

机构地区：[1]上海交通大学材料科学与工程学院,上海200240

出　　处：《电镀与精饰》2025年第3期83-95,105,共14页Plating & Finishing

摘　　要：随着芯片制造不断朝着高密度、多功能、低成本的方向发展,按照摩尔定律继续缩小的晶体管尺寸已经接近物理极限,并且面会临成本急剧升高的问题。基于芯片垂直互连的3D封装是进一步提升晶体管密度的有效手段,而铜柱凸点是芯片垂直互连的重要组成部分。首先系统介绍了铜柱凸点的基本结构及制备方法,在此基础上对工业应用中十分关心的凸点电镀均匀性控制方法、以及铜柱凸点键合界面反应和可靠性等问题进行了概述。另外,扩散阻挡层作为减缓界面反应的有效手段,能有效提升凸点的可靠性,近年来用于微凸点的高性能阻挡层材料受到了大量学者的关注。因此,在本文的最后,重点对微凸点高性能阻挡层材料研究进展进行了综述。希望通过对凸点电镀技术、可靠性问题及高性能阻挡层的研究进展情况介绍,能够给学术界以及工业界带来一些启发,以推动微凸点以及3D封装技术的发展。As chip manufacturing continues to evolve toward high density,multi-functionality,and low cost,the transistor size,which continues to shrink according to Moore's Law,is approaching its physical limit and facing a sharp increase in cost.3D packaging based on chip vertical interconnect is an effective means to further increase transistor density,and copper pillar bumps are an important part of chip vertical interconnect.This review systematically introduces the basic structure and preparation method of copper pillar bumps.On this basis,the control method of bump plating uniformity,which is of great concern in industrial applications,as well as the interface reaction and reliability of copper pillar bump bonding are summarized.In addition,diffusion barrier layer,as an effective method to mitigate the interfacial reaction,can greatly enhance the reliability of bumps.High-performance barrier layer materials for microbumps have attracted a great deal of scholarly attention in recent years.Therefore,at the end,an overview of the research progress of high-performance barrier layer materials for microbumps is emphasized.It is hoped that the introduction of the bump plating technology,reliability issues and the research progress of high-performance barrier layer can bring some inspiration to the academia as well as the industry,so as to promote the development of microbump and 3D packaging technology.

关 键 词：3D封装 凸点 电镀 可靠性 扩散阻挡层 

分 类 号：TQ153.1[化学工程—电化学工业]