supported by the Key Program of the National Natural Science Foundation of China(Grant No.51035002);the National Natural Science Foundation of China(Grant No.51305373);the Specialized Research Fund for the Doctoral Program of Higher Education of China(Grant No.20120121120035)
A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynami...
supported by Key Program of National Natural Science Foundation of China (51035002 );the National Natural Science Foundation of China (51205334);the Natural Science Foundation of Fujian Province of China (2011J05139)~~