国家自然科学基金(50501022)

作品数：2被引量：1H指数：1
导出分析报告
相关期刊：《Journal of Materials Science & Technology》更多>>
相关主题：LAYERSNWETTINGTUNABLESOLDERING更多>>
相关领域：金属学及工艺理学更多>>
-
在结果中检索

检索结果分析

结果分析中...
共 条 记 录，以下是1-2
全选清除导出
参考文献引证文献引用追踪
视图：
排序：
Tunable Reactive Wetting of Sn on Microporous Cu Layer被引量：1
《Journal of Materials Science & Technology》2012年第4期379-384,共6页Qingquan Lai Lei Zhang Cai Chen J.K.Shang 
supported by the National Natural Science Foundation of China (Grant No. 50501022);the National Basic Research Program of China (Grant No.2010CB631006)
Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interracial metallurgical r...
关键词：WETTING Porous material SOLDERING 
Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films
《Journal of Materials Science & Technology》2010年第3期200-205,共6页Wei Liu Lei Zhang J.K. Shang 
supported by the National Natural Science Foundation of China(No.50501022);the National Basic Research Program of China(No.2004CB619306)
The thermodynamic conditions for dewetting of a liquid solder drop on copper thin films were examined under a hot-stage optical microscope in a flowing protective atmosphere.Dewetting of liquid solder was found to dep...
关键词：DEWETTING SOLDER SPALLING Film thickness 
全选清除导出
共1页<1>
检索报告 对象比较 聚类工具 使用帮助 返回顶部