Project(9231083) supported by Yunnan Aerospace Industry Corporation Contract Research,China;Project(9220061) supported by City University of Hong Kong Donation Research Grant,China
A1 and N were introduced into copper substrate using plasma immersion ion implantation (PIII) in order to enhance its hardness and oxidation resistance. The dosage of N ion is 5 × 1016 cm-2, and range of dosage of ...