SOLDERING

作品数：51被引量：68H指数：5
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相关领域：金属学及工艺一般工业技术更多>>
相关作者：傅玉灿丁文锋杨长勇付建峰徐九华更多>>
相关机构：金蝶软件(中国)有限公司南京航空航天大学国电南瑞科技股份有限公司哈尔滨工业大学更多>>
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相关基金：国家自然科学基金国家重点基础研究发展计划中国博士后科学基金国家教育部博士点基金更多>>
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Ultrasonic-assisted soldering W90 Tungsten heavy alloy to AZ31B Mg alloy using Sn-x Al alloy
《Journal of Materials Science & Technology》2024年第8期132-140,共9页Xudong Zhang Wei Fu Xiaoguo Song Liangbo Chen Zhuolin Li Shengpeng Hu Hong Bian 
supported by the National Natural Science Foundation of China(nos.52105330 and 52175307);the Natural Science Foundation of Shandong Province(no.ZR2020QE175);the Taishan Scholars Foundation of Shandong Province(no.tsqn201812128).
A double-layered W/Mg structure is expected to be a new generation of nuclear radiation shielding material.The tungsten heavy alloy(W90)and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using pur...
关键词：Tungsten heavy alloy Mg alloy Ultrasonic-assisted soldering Mg_(2)Sn Cavitation effect 
Tunable Reactive Wetting of Sn on Microporous Cu Layer被引量：1
《Journal of Materials Science & Technology》2012年第4期379-384,共6页Qingquan Lai Lei Zhang Cai Chen J.K.Shang 
supported by the National Natural Science Foundation of China (Grant No. 50501022);the National Basic Research Program of China (Grant No.2010CB631006)
Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interracial metallurgical r...
关键词：WETTING Porous material SOLDERING 
Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging被引量：3
《Journal of Materials Science & Technology》2012年第1期53-59,共7页Niwat Mookam Kannachai Kanlayasiri 
the National Research Council of Thailand (NRCT) and the Faculty of Engineering, King Mongkut's Institute of Technology Ladkrabang for providing financial support
The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction betwe...
关键词：SOLDERING INTERMETALLICS MICROSTRUCTURES Activation energy 
Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging
《Journal of Materials Science & Technology》2009年第3期410-414,共5页Ning Zhao Haitao Ma Haiping Xie Lai Wang 
supported by the National Key Project of Scientific;Technical Supporting Programs during the 11th Five-year Plan (No. 2006BAE03B02-2);NSFC Key Program (No. U0734006)
The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interracial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting abil...
关键词：Lead-free solder Interfacial reaction Intermetallic compounds AGING 
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