supported by the Innovation Team Cultivation Project of Yunnan Province(No.202005AE160016);Key Research&Development Program of Yunnan Province(No.202103AA080017);Yunnan Ten Thousand Talents Plan Young&Elite Talents Project(No.YNWR-QNBJ-2018-044).
The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the t...