引线键合在温度循环下的键合强度衰减研究  

Research on Bond Strength Decay of Wire Bonding Under Temperature Cycling

作　　者：熊化兵[1] 李金龙[1] 胡琼[1] 赵光辉[1] 张文烽 谈侃侃[1] XIONG Huabing;LI Jinlong;HU Qiong;ZHAO Guanghui;ZHANG Wenfeng;TAN Kankan(The 24th Research Institute of China Electronics Technology Group Corporation,Chongqing 400060,P.R.China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2023年第2期355-358,共4页Microelectronics

基　　金：模拟集成电路国家级重点实验室基金资助项目(614280204030217)。

摘　　要：研究了18、25、30μm三种金丝和25、32、45μm三种硅铝丝键合引线在不同温度循环次数下的键合强度衰减规律,并研究了拉断模式的比例。结果表明,所有试验样品,无论是否经历温度循环,均达到了GJB548B-2005方法2011.1中的最小键合强度要求,均未出现焊点拉脱的现象。随着温度循环次数的增加,金丝键合强度先略微增大,后缓慢减小并趋于平缓。硅铝丝键合强度先较快减小,后缓慢减小,并趋于平缓。相比于金丝,硅铝丝在0~50次的温度循环下键合强度衰减较快。通过曲线拟合,获得不同丝径下的键合强度衰减变化方程。The bonding strength decay law of three kinds of gold wire of 18,25,30μm,and aluminum wire of 25,32,45μm under different temperature cycles,as well as the ratio of the breaking mode were studied.The results show that,all test samples,regardless of whether they undergo temperature cycles,have reached the minimum bond strength requirement of GJB548B-2005,and there is no puff-off mode.As the times of temperature cycles increase,the bonding strength of the gold wire increases slightly at first,then slowly decreases and tends to level off.Meanwhile,the bonding strength of aluminum wire decreases rapidly first,then decreases slowly,and tends to be gentle.Compared with gold wire,the bonding strength of aluminum wire decays faster under temperature cycles of O to 50 times.The article also obtains the bond strength attenuation change equation under different wire diameters through curve fitting.

关 键 词：微电子封装 引线键合 键合强度 温度循环 

分 类 号：TN305.94[电子电信—物理电子学]