GaN芯片封装技术研究进展与趋势  

Research Progress and Trend of GaN Chip Packaging Technology

作　　者：宋海涛 王霄 龚平 朱霞 李杨 刘璋成 闫大为 陈治伟 尤杰 敖金平 SONG Haitao;WANG Xiao;GONG Ping;ZHU Xia;LI Yang;LIU Zhangcheng;YAN Dawei;CHEN Zhiwei;YOU Jie;AO Jinping(Engineering Research Center for Intelligent Sensors and Application-Specific Integrated Circuits(Jiangsu Province),School of Integrated Circuits,Jiangnan University,Wuxi 214122,China;Engineering Research Center of IoT Technology Applications(Ministry of Education),School of Integrated Circuits,Jiangnan University,Wuxi 214122,China;Wuxi China Resources Micro-Assembly Technology Co.,Ltd.,Wuxi 214111,China)

机构地区：[1]江南大学集成电路学院江苏省智能传感器与专用集成电路工程研究中心,江苏无锡214122 [2]江南大学集成电路学院物联网技术应用教育部工程研究中心,江苏无锡214122 [3]无锡华润安盛科技有限公司,江苏无锡214111

出　　处：《电子与封装》2025年第3期123-133,共11页Electronics & Packaging

基　　金：国家自然科学基金(62104183,61991442);江苏省重点研发计划产业前瞻与关键核心技术(BE2023007-1);中央高校基本科研业务费(JUSRP123057,JUSRP123058,JUSRP123059)。

摘　　要：作为第三代半导体材料,GaN因其高电子迁移率、高击穿场强等优异特性,正被广泛应用于高频、高功率电子器件。然而,其封装技术面临诸如热管理、电气性能优化以及封装可靠性等挑战,同时还需要满足更紧凑、更集成的需求。重点讨论了目前GaN芯片封装的多种解决方案,包括晶体管外形(TO)封装、四边扁平无引线(QFN)封装等分立器件封装结构,晶圆级封装(WLP)、多芯片模块(MCM)合封器件封装结构以及诸多先进封装技术。分析了封装技术的发展趋势,如集成化、模块化封装,以及面向高频、高功率应用的优化方法。随着技术的不断突破,GaN封装有望在更高效、更可靠的方向上取得进一步进展,以满足不断增长的市场需求。As a third-generation semiconductor material,GaN is widely used in high-frequency and high-power electronic devices because of its excellent characteristics such as high electron mobility and high breakdown field strength.However,its packaging technology faces challenges such as thermal management,electrical performance optimization,and packaging reliability,as well as the need to be more compact and integrated.Various solutions for GaN chip packaging are discussed,including discrete device packaging structures of transistor outline(TO)packaging and quad-flat no-lead(QFN)packaging,closed device packaging structures of wafer-level packaging(WLP)and multi-chip module(MCM),and many advanced packaging technologies.The development trend of packaging technology is analyzed,such as integration,modular packaging,and optimization methods for high-frequency and high-power applications.With the continuous breakthrough of technology,GaN packaging is expected to make further progress in the direction of more efficient and more reliable to meet the growing market demand.

关 键 词：GAN 芯片封装 先进封装 散热 寄生电感 3D集成 

分 类 号：TN305.94[电子电信—物理电子学]