supported by the Natural Science Foundation of Beijing,China (Grant No. 4092005);the National High Technology Research and Development Program of China (Grant No. 2009AA032704);the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20091103110006)
The evaluation of thermal resistance constitution for packaged A1GaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper. The evaluation is based on the transient heat...