SOLDERING

作品数：51被引量：68H指数：5
导出分析报告
相关领域：金属学及工艺一般工业技术更多>>
相关作者：傅玉灿丁文锋杨长勇付建峰徐九华更多>>
相关机构：金蝶软件(中国)有限公司南京航空航天大学国电南瑞科技股份有限公司哈尔滨工业大学更多>>
相关期刊：更多>>
相关基金：国家自然科学基金国家重点基础研究发展计划中国博士后科学基金国家教育部博士点基金更多>>
-
在结果中检索

检索结果分析

结果分析中...
选择条件：
  • 期刊=Transactions of Nonferrous Metals Society of Chinax
共 条 记 录，以下是1-6
全选清除导出
参考文献引证文献引用追踪
视图：
排序：
In-situ Si particle-reinforced joints of hypereutectic Al−60Si alloys by ultrasonic-assisted soldering
《Transactions of Nonferrous Metals Society of China》2025年第1期77-90,共14页Yuan-xing LI Xiang-bo ZHENG Chao-zheng ZHAO Zong-tao ZHU Yu-jie BAI Hui CHEN 
financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216);Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).
To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...
关键词：hypereutectic Al−60Si alloy ultrasonic-assisted soldering Si particle reinforcement Sn−9Zn solder 
Direct active soldering of Al_(0.3)CrFe _(1.5)MnNi_(0.5) high entropy alloy to 6061-Al using Sn-Ag-Ti active solder被引量：5
《Transactions of Nonferrous Metals Society of China》2018年第4期748-756,共9页L.C.TSAO S.Y.CHANG Y.C.YU 
financial support of this work from the Ministry of Science and Technology, Taibei, China, under Projects No. MOST 105-ET-E-020002-ET, 105-2622-E-020-003-CC3
Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti ac...
关键词：high entropy alloy Sn3.5Ag4Ti active filler Al0.3CrFe1.5MnNi0.5 direct active soldering 
Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering被引量：3
《Transactions of Nonferrous Metals Society of China》2017年第4期962-970,共9页Wei-bing GUO Tian-min LUAN Xue-song LENG Jing-shan HE Jiu-chun YAN 
Project(51435004)supported by the National Natural Science Foundation of China
Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn...
关键词：aluminum alloy tin ultrasonic soldering interfacial microstructure mechanical properties 
Mechanism of Ag_3Sn grain growth in Ag/Sn transient liquid phase soldering
《Transactions of Nonferrous Metals Society of China》2017年第3期722-732,共11页Hua-kai SHAO Ai-ping WU Yu-dian BAO Yue ZHAO Gui-sheng ZOU 
Project(51375260) supported by the National Natural Science Foundation of China
Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetall...
关键词：transient liquid phase soldering Ag3Sn morphologies of grains growth kinetics activation energy 
Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys被引量：2
《Transactions of Nonferrous Metals Society of China》2011年第9期1937-1943,共7页李远星 赵维巍 冷雪松 付秋娇 王雷 闫久春 
Projects(51075104,50975054) supported by the National Natural Science Foundation of China;Project(2010RFQXG020) supported by the Harbin Excellence Talents Program,China
Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The u...
关键词：2024 aluminum alloys BRAZING SOLDERING ultrasonic-assisted soldering Zn-5Al filler metal 
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad被引量：6
《Transactions of Nonferrous Metals Society of China》2006年第6期1374-1378,共5页王俭辛 薛松柏 方典松 鞠金龙 韩宗杰 姚立华 
Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as ou...
关键词：DIODE-LASER SOLDERING SN-AG-CU LEAD-FREE SOLDER shear force microstructure 
全选清除导出
共1页<1>
检索报告 对象比较 聚类工具 使用帮助 返回顶部