supported by the National Hi-Tech Research and Development Program of China ("863" Project)(Grant Nos. 2011AA010303,2012AA012203);the National Basic Research Program of China ("973" Project)(Grant No. 2011CB301702);the National Natural Science Foundation of China (Grant Nos. 61021003,61090392)
The techniques used for the fabrication of photonic integrated circuit(PIC) chip are introduced briefly.Then a four channel DFB laser array integrated with MMI coupler and semiconductor optical amplifier(SOA) fabricat...