MULTI-CHIP

作品数：8被引量：17H指数：2
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相关领域：电子电信更多>>
相关作者：王强郭涛王洪浩王军虎王永生更多>>
相关机构：清华大学西北工业大学隆达电子股份有限公司更多>>
相关期刊：《Engineering》《Optoelectronics Letters》《光学学报》《上海交通大学学报》更多>>
相关基金：中国航空科学基金国家自然科学基金更多>>
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A Hybrid Integrated and Low-Cost Multi-Chip Broadband Doherty Power Amplifier Module for 5G Massive MIMO Application
《Engineering》2024年第7期223-232,共10页Fei Huang Guansheng Lv Huibo Wu Wenhua Chen Zhenghe Feng 
supported in part by the National Key Research and Development Program of China(2021YFA0716601);the National Science Fund(62225111).
In this paper,a hybrid integrated broadband Doherty power amplifier(DPA)based on a multi-chip module(MCM),whose active devices are fabricated using the gallium nitride(GaN)process and whose passive circuits are fabric...
关键词：5G Doherty power amplifier Multi-input multi-output Multi-chip modules Hybrid integrated 
Hybrid multi-chip assembly of optical communication engines by in situ 3D nanolithography被引量：12
《Light(Science & Applications)》2020年第1期1340-1350,共11页Matthias Blaicher Muhammad Rodlin Billah Juned Kemal Tobias Hoose Pablo Marin-Palomo Andreas Hofmann Yasar Kutuvantavida Clemens Kieninger Philipp-Immanuel Dietrich Matthias Lauermann Stefan Wolf Ute Troppenz Martin Moehrle Florian Merget Sebastian Skacel Jeremy Witzens Sebastian Randel Wolfgang Freude Christian Koos 
supported by the Bundesministerium fur Bildung und Forschung(BMBF)Projects PHOIBOS(Grant 13N1257)and SPIDER(Grant 01DR18014A);by the Deutsche Forschungsgemeinschaft(DFG,German Research Foundation)under Germany´s Excellence Strategy via the Excellence Cluster 3D Matter Made to Order(EXC-2082/1-390761711);by the Helmholtz International Research School for Teratronics(HIRST);by the European Research Council(ERC Consolidator Grant‘TeraSHAPE’,#773248);by the H2020 Photonic Packaging Pilot Line PIXAPP(#731954);by the EU-FP7 project BigPipes;by the Alfried Krupp von Bohlen und Halbach Foundation;by the Karlsruhe Nano-Micro Facility(KNMF);by the Deutsche Forschungsgemeinschaft(DFG)through CRC#1173(‘WavePheonmena’).
Three-dimensional(3D)nano-printing of freeform optical waveguides,also referred to as photonic wire bonding,allows for efficient coupling between photonic chips and can greatly simplify optical system assembly.As a ke...
关键词：communication LITHOGRAPHY BONDING 
Self-adaptive phosphor coating technology for wafer-level scale chip packaging
《Journal of Semiconductors》2013年第5期96-99,共4页周琳淞 饶海波 王伟 万贤龙 廖骏源 王雪梅 周炟 雷巧林 
supported by the Guangdong Province Scientific Research Program(Nos.2011B090400083,2011A081301019)
A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied ...
关键词：white light-emitting diodes self-adaptive conformal coating wafer level encapsulation technology multi-chip packaging 
Spectral spatial coherence of high-power multi-chip LEDs
《Optoelectronics Letters》2012年第6期422-425,共4页陈光明 陶华 林惠川 陈子阳 蒲继雄 
supported by the National Natural Science Foundation of China(Nos.60977068and61178015)
We investigate the spatial coherence of the light generated from high-power multi-chip red LEDs by usmg the van Cittert- Zernike theorem. It is theoretically demonstrated that the light generated from multi-chip LEDs ...
关键词：Magnetic materials Optoelectronic devices 
Rate of Phase Difference Change Estimation in Single Airborne Passive Locating System被引量：5
《Chinese Journal of Aeronautics》2009年第2期184-190,共7页王军虎 王永生 郭涛 王洪浩 王强 
Aeronautical Science Foundation of China (2007ZC53030)
As an important parameter in the single airborne passive locating system, the rate of phase difference change contains range information of the radio emitter. Taking single carrier sine pulse signals as an example, th...
关键词：LOCATION rate of phase difference change Cramér-Rao lower bound phase discrimination multi-chip processing 
Correlated Color Temperature Tunable Multi-chip Light Emitting Diodes Light Source Design
《Semiconductor Photonics and Technology》2008年第1期1-7,共7页SHEN Hai-ping PAN Jian-gen FENG Hua-jun 
National High Technology Research and Development(863) Programof China(2006AA03A173)
One of the methods to derive white light from light emitting diodes(LEDs)is the multi-chip white LED technology,which mixes the light from red,green and blue LEDs.Introduced is an optimal algorithm for the spectrum de...
关键词：LED light source CCT tunable luminous efficacy color rendering optimal design 
Study on MCM Interconnect Test Generation Based on Ant Algorithm with Mutation Operator
《上海交通大学学报》2007年第S2期150-153,共4页陈雷 
A novel multi-chip module(MCM) interconnect test generation scheme based on ant algorithm(AA) with mutation operator was presented.By combing the characteristics of MCM interconnect test generation,the pheromone updat...
关键词：MULTI-CHIP module(MCM) INTERCONNECT TEST ANT algorithm(AA) TEST generation MUTATION 
PLC Multi-Chip Integration Technologies
《光学学报》2003年第S1期199-200,共2页Motohaya Ishii 
This paper reviews recent progress on integrated multi-chip modules composed of silica-based planar lightwave circuits (PLCs) with a relatively high core-to-cladding index contrast A. These compact and highly function...
关键词：PLC Multi-Chip Integration Technologies with in that of AWG FIGURE 
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