基于平行缝焊工艺的AuSn合金焊料封盖技术研究  

Development of AuSn Alloys Solder Sealing Technology Based on Parallel Seam Sealing Process

作　　者：李茂松[1] 欧昌银[1] 陈鹏[1] 赵光辉[1] 胡琼[1] 黄大志[1] 朱虹姣[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2007年第3期349-353,共5页Microelectronics

摘　　要：为了解决聚合物粘结电路的质量与长期可靠性问题,提出了一种采用平行缝焊工艺对AuSn合金焊料熔封器件进行封盖的新方法。通过对平行缝焊工艺的深入研究,解决了该类器件封盖的气密性与外观质量问题,从而找到了一种有效解决熔封外壳组装的低温聚合物粘结电路水汽含量、抗剪强度、键合强度控制的新方法。A new method for AuSn Alloys solder sealing technology using parallel seam sealing process is proposed to achieve high quality and long term reliability of polymer attachment devices. By investigating parallel seam sealing process, problems associated with hermeticity and appearance quality of the device are solved and an effective method is found to control moisture contents, shear strength and bonding strength of low-temperature polymer adhered circuits in AuSn alloy solder sealed packages.

关 键 词：封装 水汽控制 平行缝焊 气密性 合金封盖 

分 类 号：TN305.94[电子电信—物理电子学]