supported by the National High Technology Research and Development Program of China(Grant No.2015AA016501);the National Natural Science Foundation of China(Grant No.61306129)
In the process of high-k films fabrication, a novel multi deposition multi annealing (MDMA) technique is introduced to replace simple post deposition annealing. The leakage current decreases with the increase of the...
supported by the National High Technology Research and Development Program of China(Grant No.SS2015AA010601);the National Natural Science Foundation of China(Grant Nos.61176091 and 61306129);the Opening Project of Key Laboratory of Microelectronics Devices&Integrated Technology,Institute of Micro Electronics of Chinese Academy of Sciences
The thickness effect of the TiN capping layer on the time dependent dielectric breakdown(TDDB) characteristic of ultra-thin EOT high-k metal gate NMOSFET is investigated in this paper.Based on experimental results,i...
supported by the National High Technology Research and Development Program of China(Grant No.SS2015AA010601);the National Natural Science Foundation of China(Grant Nos.61176091 and 61306129);the Opening Project of Key Laboratory of Microelectronics Devices&Integrated Technology,Institute of Micro Electronics of Chinese Academy of Sciences
High-k metal gate stacks are being used to suppress the gate leakage due to tunneling for sub-45 nm technology nodes.The reliability of thin dielectric films becomes a limitation to device manufacturing,especially to ...
Project supported by the National High Technology Research and Development Program of China(Grant No.SS2015AA010601);the National Natural Science Foundation of China(Grant Nos.61176091 and 61306129)
The positive bias temperature instability(PBTI) degradations of high-k/metal gate(HK/MG) n MOSFETs with thin TiN capping layers(1.4 nm and 2.4 nm) are systemically investigated. In this paper, the trap energy di...
supported by the National High Technology Research and Development Program of China(Grant No.SS2015AA010601);the National Natural Science Foundation of China(Grant Nos.61176091 and 61306129)
A multi-deposition multi-annealing technique (MDMA) is introduced into the process of high-k/metal gate MOSFET for the gate last process to effectively reduce the gate leakage and improve the device's performance. ...
Project supported by the National Science&Technology Major Projects of the Ministry of Science and Technology of China(Grant No.2009ZX02035);the National Natural Science Foundation of China(Grant Nos.61176091 and 61306129)
A new method is proposed to extract the energy distribution of negative charges, which results from electron trapping by traps in the gate stack of n MOSFET during positive bias temperature instability(PBTI) stress ...
Project supported by the Important National Science&Technology Specific Projects(No.2009ZX02035);the National Natural Science Foundation of China(Nos.61176091,61306129)
Positive bias temperature instability(PBTI) characteristics and degradation mechanisms of NMOSFET with high-k/metal gate last process have been systematically investigated. The time evolution of threshold voltage sh...
Project supported by the Important National Science&Technology Specific Projects(No.2009ZX02035);the National Natural Science Foundation of China(Nos.61176091,61306129)
: We introduced a TaN/TiAl/top-TiN triple-layer to modulate the effective work function of a TiN-based metal gate stack by varying the TaN thickness and top-TiN technology process. The results show that a thinner TaN...
Project supported by the Important National Science & Technology Specific Projects(No.2009ZX02035);the National Natural Science Foundation of China(Nos.61176091,61306129)
We evaluated the TiN/TaN/TiA1 triple-layer to modulate the effective work function (EWF) of a metal gate stack for the n-type metal-oxide-semiconductor (NMOS) devices application by varying the TiN/TaN thickness. ...
Project supported by the Important National Science & Technology Specific Projects(No.2009ZX02035);the National Natural Science of China(No.61306129);the National Found for Fostering Talents of Basic Science(No.J0730318)
The characteristics of TDDB (time-dependent dielectric breakdown) and SILC (stress-induced leakage current) for an ultra-thin SiO2/HfO2 gate dielectric stack are studied. The EOT (equivalent-oxide-thickness) of ...