supported by the State Key Program and Major Program of National Natural Science Foundation of China (Grant Nos. 60736033 and 60890191);the Fundamental Research Funds for the Central Universities (Grant No. JY10000925002)
AlGaN/GaN metal-insulator-semiconductor high electron-mobility transistors (MIS-HEMTs) with atomic layer deposited (ALD) NbA10 gate dielectric were investigated using 3 MeV proton irradiation at a fluence of 1015 ...
supported by the National Natural Science Foundation of China (Grant Nos.60736033,60890191);the Fundamental Research Funds for the Central Universities (Grant Nos.JY10000925002,JY10000-904009)
In this paper, we systematically study the positive gate leakage current in AlGaN/GaN metal-oxide-semiconductor high electron-mobility transistors (MOS-HEMTs) with HfO 2 dielectric using atomic layer deposition (ALD)....
Project supported by the Fundamental Research Funds for the Central Universities,China (Grant No.JY10000925002);the National Key Science & Technology Special Project,China (Grant No.2008ZX01002-002);the National Natural Science Foundation of China (Grant Nos.60736033,60976068,and 61076097)
A GaN/A10.3Ga0.TN/A1N/GaN high-electron mobility transistor utilizing a field plate (with a 0.3 μm overhang towards the drain and a 0.2 μm overhang towards the source) over a 165-nm sputtered HfO2 insulator (HfO2...
Project supported by the State Key Program and Major Program of the National Natural Science Foundation of China (Grant Nos. 60736033 and 60890191);the Fundamental Research Funds for the Central Universities (Grant Nos. JY10000925002 and JY10000904009)
This paper studies the drain current collapse of A1GaN/GaN metal insulator-semiconductor high electron-mobility transistors (MIS-HEMTs) with NbA10 dielectric by applying dual-pulsed stress to the gate and drain of t...
Project supported by the Fundamental Research Funds for the Central Universities,China(Grant No.JY10000925002);the National Key Science and Technology Special Project(Grant No.2008ZX01002-002);the National Natural Science Foundation of China(Grant Nos.60736033,60976068 and 61076097);New Teacher Foundation for Doctoral Program of Ministry of Education of China(Grant No.200807011012)
We present an AIInN/AlN/GaN MOS-HEMT with a 3 nm ultra-thin atomic layer deposition (ALD) Al2O3 dielectric layer and a 0.3 μm field-plate (FP)-MOS-HEMT. Compared with a conventional AIInN/AlN/GaN HEMT (HEMT) wi...
supported by the State Key Program and Major Program of National Natural Science Foundation of China (Grant Nos. 60736033 and 60890191)
We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT) with an NbAIO high-k dielectric deposited by atomic layer deposition (ALD). Surface morphology of samples are obse...
supported by the National Natural Science Foundation of China (Grant Nos. 60736033,60676048)
The electrical properties of two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructures using high temperature (HT) AlN interlayers (ITs) grown on c-plane sapphire substrate by metal organic chemical vapor depo...
Project supported by the National Natural Science Foundation of China (Grant Nos. 60736033 and 60676048)
Comparative study of high and low temperature AlN interlayers and their roles in the properties of GaN epilayers prepared by means of metal organic chemical vapour deposition on (0001) plane sapphire substrates is c...
Project supported by the National Natural Science Foundation of China (Grant Nos. 60736033 and 60376024);the National Key Technology Research and Development Program of the Ministry of Science and Technology of China (Grant No. 2007BAK25B03)
This paper studies the effect of drain bias on ultra-short p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET) degradation during negative bias temperature (NBT) stress. When a relatively large g...
supported by the National Natural Science Foundation of China(Nos.60736033,60676048).
An X-band four-way combined GaN solid-state power amplifier module is fabricated based on a self- developed AlGaN/GaN HEMT with 2.5-mm gate width technology on SiC substrate. The module consists of an Al- GaN/GaN HEMT...