云南高校图书馆联盟文献共享服务平台- SOLDERING

SOLDERING: 作品数：51被引量：68H指数：5; 导出分析报告; 相关领域：金属学及工艺一般工业技术更多>>; 相关作者：傅玉灿丁文锋杨长勇付建峰徐九华更多>>; 相关机构：金蝶软件(中国)有限公司南京航空航天大学国电南瑞科技股份有限公司哈尔滨工业大学更多>>; 相关期刊：更多>>; 相关基金：国家自然科学基金国家重点基础研究发展计划中国博士后科学基金国家教育部博士点基金更多>>

Low-temperature soldering process of AlN/Cu enhanced by Ti addition被引量：1: 《China Welding》2023年第3期36-40,共5页荆文王智新曹宇堃赵松柏宋北黄玉平; Aluminum Nitride(AlN)ceramics were soldered to Cu substrate using active metallized Sn0.3Ag0.7Cu-x%Ti(wt.%,where x=2,4,6,8)at 250℃.This process yielded a robust and closely integrated metallized layer on the AlN cera...; 关键词：reactive metallization BRAZING Alumimum Nitride copper

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature: 《China Welding》2023年第2期23-31,共9页宋立志肖勇奚邦富李佳琪张建; the National Natural Science Foundation of China(No.52171045).; Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ...; 关键词：5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties

Fluxless bonding with silver nanowires aerogel in die-attached interconnection: 《China Welding》2023年第2期32-41,共10页傅必成方毅张乐李道会齐放宋利军祝温泊; the National Natural Science Foundation of China(Grant No.52075125,No.52105331);the Shenzhen Science and Technology Innovation Committee(Grant No.JCYJ20210324124203009,No.JSGG20201102154600003,No.GXWD20220818163456002);Special Fund for Science and Technology Innovation Strategy of Guangdong Province(Grant No.pdjh2022b0570);Sustainedly Supported Fundation by National Key Laboratory of Science and Technology on Space Microwave under Grant HTKJ2022KL504011,and NIO University Programme(NIO UP).; The electronic product has gravitated towards component miniaturization and integration, employment of lead-free materials, and low-temperature soldering processes. Noble-metal aerogels have drawn increasing attention...; 关键词：silver nanowires aerogel nanostructured materials soldering preform BONDING curved surface

Bonding mechanisms of SiO_(2) glass and 1060 Al by ultrasonic assisted active metal soldering process被引量：5: 《China Welding》2023年第2期52-62,共11页武晓伟符军红卫首敬董红杰王健王浩然宋晓国李卓霖; In this work,the ultrasonic assisted active metal soldering of SiO_(2) glass and Al was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250℃in ambient atmosphere.A nano-crystalline...; 关键词：BONDING microstructure intermetallic compounds interface OXIDATION FRACTURE

A review of soldering by localized heating被引量：1: 《China Welding》2023年第2期1-15,共15页崔鹏杨婉春彭飞祝温博杨帆李明雨; The research was supported by the National Natural Science Foundation of China(Grant No.52105331);the Shenzhen Science and Technology Innovation Committee(Grant No.JSGG20201102154600003,GXWD20220818163456002,JCYJ20210324124203009).; In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm...; 关键词：localized soldering high heat dissipation small size induction soldering focused heating

Mg_(2)Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints被引量：2: 《China Welding》2022年第1期47-59,共13页Cao Huijun Li shiqin Zhang Yinggan Zhu Yichen Li Mingyu Zhang Zhihao; supported by Science and Technology Planning Project of Shenzhen (Grant No. JCYJ201908 09161213154);Xiamen Youth Innovation Fund Project (Grant No. 3502Z20206026);Academy-level Project of Xiamen City University (Grant No.KYKJ2019-4)。; In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confi...; 关键词：Mg alloys ultrasonic wave solder joint Sn whisker microstructure growth mechanism

Microstructure evolution and mechanical properties of the Sip/Zn- Al composite joints by ultrasonic-assisted soldering in air被引量：4: 《China Welding》2018年第2期39-44,共6页Kang Yuqing Shen Haoran Fu Yang Chen Yunru Xu Chang Li Xin Gu Keyun Li Xiaohai An Ledong Wang Qian; sponsored by the National Natural Science Foundation of China(Grant No.51504165);the Project funded by the China Postdoctoral Science Foundation(Grant No.2016M601271);Tianjin Scince&Technology Project(Grant No.16JCQNJC02600); Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtai...; 关键词：Hypereutectic Al - Si alloys ultrasonic SOLDERING microstructure mechanical properties

Low temperature soldering alloy using Sn63 Pb37 implantation of silica ceramics and copper solder assisted by ion and deposition: 《China Welding》2012年第3期38-43,共6页徐睦忠田修波巩春志杨波杨士勤; Copper ion implantation and deposition technique was applied as a pretreatment method for low temperature joining of silica ceramic （ SiO2 ） and copper alloy. The effect of copper ion implantation and deposition par...; 关键词：ion implantation and deposition SI02 COPPER low temperature SOLDERING

Low temperature bonding of LD31 aluminum alloys by electric brush plating Ni and Cu coatings被引量：2: 《China Welding》2005年第1期24-28,共5页赵振清王春青杜淼; Soldering of LD31 aluminum alloys using Sn-Pb solder paste after electric brush plating Ni and Cu coatings was investigated. The technology of electric brush plating Ni and Cu was studied and plating solution was deve...; 关键词：LD31 aluminum alloy electric brush plating coating SOLDERING

Test research and mechanism analysis of vacuum fluxless laser soldering for SMD: 《China Welding》1998年第2期62-70,共9页冯武锋王春青李明雨孙福江; This project is subsidized by Natural Science Funds of Naion.The authorized number is 59671063.; Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out...; 关键词：VACUUM fluxless soldering LASER SMD (Surface Mount Device)

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