National Science and Technology Major Project of the Ministry of Science And Technology of China(No.2013YQ240803);Shanxi Programs for Science and Technology Development(Nos.20140321010-02,201603D121040-1);Scientific and Technological Innovation Programs of Higher Education Institutions of Shanxi Province(No.2013063)
Voids are one of the major defects in ball grid array (BGA) solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible ...