supported in part by the National Research Foundation of Korea(NRF)grant funded by the Ministry of Science and ICT(No.2021R1C1C1004422);Korea Institute of Energy Technology Evaluation and Planning(KETEP)grant funded by the Korea government(MOTIE)under Grant No.20224000000020.
The emerging nonvolatile memory,three-dimensional vertical resistive random-access memory(VRRAM),inspired by the vertical NAND struc-ture,has been proposed to replace NAND flash memory which has reached its integratio...
supported in part by the National Key Research and Development Program of China under Grant2022YFB3604400;in part by the Youth Innovation Promotion Association of Chinese Academy Sciences(CAS);in part by CAS-Croucher Funding Scheme under Grant CAS22801;in part by National Natural Science Foundation of China under Grant 62334012,Grant 62074161,Grant 62004213,Grant U20A20208;Grant 62304252;in part by the Beijing Municipal Science and Technology Commission project under Grant Z201100008420009 and Grant Z211100007921018;in part by the University of CAS;in part by IMECAS-HKUST-Joint Laboratory of Microelectronics。
In this study,we present the development of self-aligned p-channel Ga N back gate injection transistors(SA-BGITs)that exhibit a high ON-state current.This achievement is primarily attributed to the conductivity modula...
National Natural Science Foundation of China(12274299,92050202);Science and Technology Commission of Shanghai Municipality(22QA1406600);Natural Science Foundation of Shanghai Municipality(20ZR1437600).
A fiber-based,self-aligned dual-beam laser direct writing system with a polarization-engineered depletion beam is designed,constructed,and tested.This system employs a vortex fiber to generate a donut-shaped,cylindric...
This work was supported by DARPA MTO PRIGM-AIMS program agreement No.W911NF1820180.S.-G.L.and H.-S.P.were also supported by Korea Research Institute for Defense Technology Planning and Advancement(KRIT),F210001.The samples were fabricated at Birck Nanotechnology Center at Purdue University.
Considering the evolution of rotation sensing and timing applications realized in micro-electro-mechanical systems(MEMS),flexural mode resonant shapes are outperformed by bulk acoustic wave(BAW)counterparts by achievi...
supported by the Strategic Priority Research Program of the Chinese Academy of Sciences(XDB 30000000);the National Natural Science Foundation of China(22021002and 61390502);the Beijing National Laboratory for Molecular Sciences(BNLMS-CXXM-202101)。
Intrinsic graphene features semi-metallic characteristics that limit its applications in electronic devices,whereas graphene nanoribbons(GNRs) are promising semiconductors because of their bandgap-opening feature. How...
supported by the National Natural Science Foundation of China (No.61805142);the Shanghai Science and Technology Committee (No.19060502500);the Natural Science Foundation of Shanghai (No.20ZR1437600)。
A fiber-based source that can be exploited in a stimulated emission depletion(STED) inspired nanolithography setup is presented.Such a source maintains the excitation beam pulse, generates a ring-shaped depletion beam...
Nanowires(NWs)and nanobelts(NBs)have been widely studied and fabricated into a variety of nanoscale devices such as light emitting diodes(LEDs),lasers and biosensors.These unique materials have attracted sustained att...
I thank the higher management team from Shanghai IC R&D Company for the support of this work.
5 nm logic process is the current leading-edge technology which is under development in world-wide leading foundries.In a typical 5 nm logic process,the Fin pitch is 22~27 nm,the contact-poly pitch(CPP)is 48?55 nm,and...
With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 n...
Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use.Theoretically any small size of pitch can be achieved by repeating SADP on same wafer...